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Thermal Test and Simulation Board for a LTE Reference Platform

  • Target of this Diploma Thesis is the development of a thermal simulation card to analyze the thermal behavior of a LTE PCIe Mini data card for GSM/UMTS based wireless networks in different environments. The power consumption of modern wireless communication systems has increased dramatically during the last years. Especially for the next generation of wireless modem cards the thermal dissipations will be slightly on or even beyond the official guidelines of the components and the whole card. To gain knowledge about the behavior of the data card, it shall be simulated with software as well as real hardware. As the ASIC components are not available yet, a hardware emulation shall be developed. The thesis covers the whole development process from the idea, the conception, the layout to the assembly and the measurements. It starts with finding a way of emulating the mounted components, measuring and powering. Afterwards a card, incorporating the principles found before, will be developed. An additional software simulation gives comparative values against the measurements. After assembling the emulation cards and running reference measurements, trials for temperature improvements will be ran and compared with the simulations.

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    Diplomarbeit

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Metadaten
Author:Silvio Herrmann
URN:urn:nbn:de:bsz:mit1-opus-46916
Document Type:Diploma Thesis
Language:English
Date of Publication (online):2014/11/28
Release Date:2014/11/28
GND Keyword:Gedruckte Schaltung
Institutes:01 Elektro- und Informationstechnik
Dewey Decimal Classification:620 Ingenieurwissenschaften und Maschinenbau
Access Rights:Innerhalb der Hochschule
Licence (German):License LogoEs gilt das UrhG