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We report on our recent progress in creating a new type of compact laser that uses thulium-based fiber CPA technology to emit a central wavelength of 2 μm. This laser can produce pulse energies of >100 μJ and an average power of >15 W. It is designed to be long-lasting and is built for industrial use, making it a great fit for integration into laser machines used for materials processing. These laser parameters are ideal for working with semiconductors like silicon, allowing for tasks such as micro-welding, cutting of filaments, dicing, bonding and more.